AMD will be launching two variants of both the B650 and X670 chipsets later this year. The standard variants and the Extreme with the E suffix. (WCCFTech (similar to X670E), the B650E boards will feature full-fledged PCIe Gen 5 support for both the NVMe storage and PCIe graphics, unlike standard B650 where it will be limited to the former. At the top of the stack, we’re looking at 24 PCIe 5.0 lanes which will be cut down gradually as we move from pricey X670E to the more affordable B650 options.) According to
Mainline overclocking should be supported across all 600 series boards but the X670/X670E may feature certain additional features. As you may expect, there will be a notable price difference between the standard and E models. This is primarily due to the inclusion of PCIe Gen 5 that requires superior PCBs and repeaters/redrivers for enhanced signal integrity. As such, the B650E boards will be priced closer to entry-level X670 boards while the top-end X670 offerings will cost nearly the same as X670E parts.
All the 600-series motherboards will come with EXPO (Extended Profiles for Overclocking) support, an alternative to Intel’s XMP. We should hear more about Zen 4 and the Ryzen 7000 family next month. The performance, power, and other feature-level upgrades have been reportedly underplayed by quite a bit.