AMD’s next-gen 5nm chips are on track for launch in the second half of the year. The Ryzen 7000 and the Epyc Genoa CPUs based on the Zen 4 core architecture have already entered mass production with early chip samples (ES and QS) powered on and undergoing testing. These processors will adopt the new AM5 socket and launch alongside the new X670 motherboards which too are said to be leveraging a dual-die chipset. Unlike Intel’s Alder and Raptor Lake CPUs, though, memory support will be limited to DDR5-5600.
The next-gen family of Ryzen APUs, codenamed Phoenix is also about to begin mass production. The Ryzen 7000 “Phoenix” processors will have integrated graphics on par with the GeForce RTX 3060 mobile (60W). This is an incredible leap in iGPU performance as you’re getting the capabilities of a midrange laptop that costs over $1,500 for roughly $1,000-1,200. The CPU core counts should stay unchanged at 8 (16 threads). The inclusion of LPDDR5 memory and TSMC’s 5nm node will significantly improve the performance and power efficiency of AMD’s next-gen products. Phoenix will power thin and light gaming laptops with a thickness of less than 20mm.
Finally, we have the Radeon RX 7000 GPUs which will allegedly feature a total of seven chiplets. Out of these, one will be the 5nm Graphics Compute Chiplet or GCD while the remaining six will consist of 6nm MCDs (Memory Complex/Controller Die). The Radeon RX 7800 XT (Navi 31) and 7900 XT (Navi 32) will have a chiplet design as explained above while the RX 7700 XT (Navi 33) will stick to a monolithic 6nm die. According to our well-renounced tipster, the latter is about to enter mass production next month, making an October launch of the RX 7700 XT highly likely.