Intel’s 14th Gen family will be the first consumer lineup to feature two distinct architectures: Meteor and Arrow Lake. Furthermore, while the former will be fabbed by the chipmaker’s internal 4nm node, the latter will be split between the 20A and TSMC’s N3 (3nm) process. And this is the primary compute die we’re talking about. The GPU tile will be manufactured on TSMC’s 5nm node across the entire platform.
For Arrow Lake, the desktop “S” lineup will be outsourced to TSMC’s 3nm process, while mobile “P” offerings will be fabbed on the internal 20A node. The two should be on par in terms of density and performance, or at least in the same ballpark. This decision, if true, is likely due to the limited process capacity of the 20A node,
The graphics and compute dies will be stacked atop the substrate using Foveros 3D packaging technology across the entire 14th Gen family. These chips will compete against AMD’s Zen 5 and Zen 6 processors, which will also be fabbed on the TSMC 3nm node (N4 for Zen 5, maybe).