AMD’s Ryzen 7 5800X3D processor will be the first consumer chip to feature vertical 3D stacking in the form of an L3 cache dies. Based on TSMC’s CoWoS advanced packaging technology, this octa-core CPU will retain the Zen 3 core architecture as mentioned in the specifications below. This pretty much confirms that the 6nm optimizations of Rembrandt won’t be passed onto the desktop SKU which is expected to launch in April or May.
In addition to the 32MB of L3 cache paired with the Core Complex on the CCD, the Ryzen 7 5800X3D will consist of an additional 64MB cache die stacked atop the compute chiplet. This brings up the overall L3 cache size to 96MB. As already demonstrated with the 3rd and 4th Gen Ryzen processors, the last-level cache has a substantial impact on gaming performance. AMD’s own testing shows a boost of roughly 15% with the 64MB cache die.
One drawback of 3D stacking is that it adversely affects the thermals of the CCD, prompting a drop in the boost clocks. The Ryzen 7 5800X3D pulls down the 4.7GHz peak frequency of its predecessor to 4.5GHz. Regardless, it still manages to exhibit a generational uplift in gaming performance which may make the Ryzen 7000 “Zen 4” processors seem less impressive.