We covered the Ryzen 7 4700S in an earlier post, explaining how it’s likely a defective Xbox Series X|S die repurposes as a desktop processor. Just like the new consoles, it features eight Zen 2 cores with hyper-threading, with a boost clock of 4.0 GHz. Furthermore, similar to the Series X|S, it features 16GB of GDDR6 memory, but no info has been provided on the memory bandwidth of the system which is the key distinguishing feature between the next-gen Xbox and PS5 consoles. This is likely deliberate, and will only be discovered once someone tests the system.
The reason why this particular SoC was made into a consumer desktop system is because of the faulty GPU which has been disabled. The Series X features a custom RDNA 2 GPU with 52 CUs and a boost clock of up to 1.8 GHz. This particular model lacks a GPU and requires a discrete option. Considering the limited number of PCIe lanes, it’s going to be ideal to use a budget option, lest you’re likely to run into a PCIe bandwidth limitation.
Looking at this SKU, it seems that these SoCs were discarded at an early stage as the PCB is quite different from the Xbox and PS5 designs. The power phases are less wider, and overall, consist of cheaper components compared to the ones used in the consoles. This isn’t surprising as this board is going to be sold with slim profit margins. However, it does indicate that these SKUs were filtered out during one of the early stages of manufacturing.
The die has been paired with a standard $20 aluminum heatsink and fan. In terms of I/O options, you get one USB 3.0 port at the front and four at the back, plus four USB 2.0 options at the rear along with an Ethernet port and the HD audio jacks. The CPU is using a 5-phase (unknown) VRM solution and 3-phase for the memory.
