TSMC is already looking to fast-track the development of its 2nm node, with a “major client” looking to place orders as soon as possible. At its Technology Symposium yesterday, the Taiwanese foundry disclosed that it’s closely working with a major client to accelerate its 2nm R&D and allow investments for the same.
At the same time, TSMC also plans to build its 2nm wafer factory in Hsinchu, Taiwan, near its HQ, for which land has already been procured. As far as this client is concerned, it’s almost certainly Apple which has been getting preferential treatment over the last decade or so.
| N7 vs 16FF+ | N7 vs N10 | N7P vs N7 | N7+ vs N7 | N5 vs N7 | N5P vs N5 | N3 vs N5 | |
|---|---|---|---|---|---|---|---|
| Power | -60% | <-40% | -10% | -15% | -30% | -10% | -25-30% |
| Performance | +30% | ? | +7% | +10% | +15% | +5% | +10-15% |
| Logic Area Reduction % (Density) | 70% | >37% | – | ~17% | 0.55x -45% (1.8x) | – | 0.58x -42% (1.7x) |
| Volume Manufacturing | Q2 2019 | Q2 2020 | 2021 | H2 2022 |
The 3nm node, the next major process following the 5nm EUV node is expected to be 1.7x denser than the latter. As per the foundry’s own figures, N3 will be 10-15% faster than N5 and nearly 30% more power-efficient. N3 will begin risk production in 2021 with volume production expected to start the same year as N4, in the second half of 2022.
During the same time frame, TSMC will introduce the N4 node which is another refinement of the N5 process, using additional EUV layers to improve density and performance. The risk production for N4 is slated for Q4 2021, followed by the volume production in 2022.
