Tremont
- Jan- 2020 -28 JanuaryNews
Intel Lakefield Chip with Foveros 3D Packaging Technology Spotted
One of Intel’s most awaited products in 2020 is the Lakefield SoC, the first chip to feature 3D stacking “Foveros”…
Read More » - Nov- 2019 -16 NovemberNews
Intel Lakefield Hybrid CPU with Foveros Packaging Technology Leaked
I’m sure you’ve heard about Intel’s Lakefield chip. A hybrid CPU for ultra-low-power notebooks leveraging a big-little design similar to…
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