Tremont
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Jan- 2020 -28 JanuaryNews
Intel Lakefield Chip with Foveros 3D Packaging Technology Spotted
One of Intel’s most awaited products in 2020 is the Lakefield SoC, the first chip to feature 3D stacking “Foveros”…
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Nov- 2019 -16 NovemberNews
Intel Lakefield Hybrid CPU with Foveros Packaging Technology Leaked
I’m sure you’ve heard about Intel’s Lakefield chip. A hybrid CPU for ultra-low-power notebooks leveraging a big-little design similar to…
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