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- Jan- 2020 -31 JanuaryCPUs
Intel 11th Gen Tiger Lake CPUs: Specifications, Launch Date and Rumors
Intel finally launched its 10nm chips in the form of the Ice Lake mobile chips last year. Based on the…
Read More » - 28 JanuaryNews
Intel Lakefield Chip with Foveros 3D Packaging Technology Spotted
One of Intel’s most awaited products in 2020 is the Lakefield SoC, the first chip to feature 3D stacking “Foveros”…
Read More » - Dec- 2019 -16 DecemberCPUs
Intel’s Next Processor Architecture Reportedly Surfaces in the Form of the Core i5-11600K?
When it comes to the core architecture, or well actually any architecture, Intel hasn’t made a lot of progress in…
Read More » - Nov- 2019 -16 NovemberNews
Intel Lakefield Hybrid CPU with Foveros Packaging Technology Leaked
I’m sure you’ve heard about Intel’s Lakefield chip. A hybrid CPU for ultra-low-power notebooks leveraging a big-little design similar to…
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