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Intel Lakefield

  • Jan- 2020 -
    28 January
    News
    Areej

    Intel Lakefield Chip with Foveros 3D Packaging Technology Spotted

    One of Intel’s most awaited products in 2020 is the Lakefield SoC, the first chip to feature 3D stacking “Foveros”…

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  • 15 January
    CPUs
    Areej

    Custom Qualcomm Chip Beats 10nm Intel Lakefield SoC in MS Surface Pro X

    The past year was quite unsatisfactory for Intel. AMD’s Ryzen 3000 processors destroyed Intel’s existing 9th Gen Coffee Lake lineup,…

    Read More »
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