Intel Lakefield
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Jan- 2020 -28 JanuaryNews
Intel Lakefield Chip with Foveros 3D Packaging Technology Spotted
One of Intel’s most awaited products in 2020 is the Lakefield SoC, the first chip to feature 3D stacking “Foveros”…
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15 JanuaryCPUs
Custom Qualcomm Chip Beats 10nm Intel Lakefield SoC in MS Surface Pro X
The past year was quite unsatisfactory for Intel. AMD’s Ryzen 3000 processors destroyed Intel’s existing 9th Gen Coffee Lake lineup,…
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