Intel Lakefield
- Jan- 2020 -28 JanuaryNews
Intel Lakefield Chip with Foveros 3D Packaging Technology Spotted
One of Intel’s most awaited products in 2020 is the Lakefield SoC, the first chip to feature 3D stacking “Foveros”…
Read More » - 15 JanuaryCPUs
Custom Qualcomm Chip Beats 10nm Intel Lakefield SoC in MS Surface Pro X
The past year was quite unsatisfactory for Intel. AMD’s Ryzen 3000 processors destroyed Intel’s existing 9th Gen Coffee Lake lineup,…
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