Intel to Launch 23 Xeon Sapphire Rapids-SP CPUs Later this Year: Up to 60 Cores, 64GB of On-Die HBM, and 350W TDP [Report]

The specifications of Intel’s upcoming 4th Gen Xeon Scalable processors have leaked out in their entirety. The data was shared by YuuKi_AnS on Twitter a day back. Intel seems to be preparing a total of 23 SKUs as part of the Sapphire Rapids-SP family, ranging from 24 core to 60 core variants. The entry-level models come with a TDP of 225W while the higher-end parts extend it to 350W. It would seem that Intel has decided to offer the fully enabled variant of the quad-tiled processor with 60 cores and 120 threads which is something we hadn’t anticipated. Most of the previous rumors hinted at the flagship topping out at 56 cores. The specifications of the primary SKUs are as follows:

One of the highlights of the Sapphire Rapids lineup will be the advanced packaging technologies used, most notably Integrated Multichip Interconnect Bridge (EMIB), Foveros 3D stacking, as well as on-die HBM memory. The robust tiled (chiplet) design will allow the dies to function independently, allowing each thread access to all the resources on all the dies. The low latency and high bandwidth capabilities of EMIB are at the core of this design.

Multiple variants of Sapphire Rapids will come with on-die HBM memory. Up to four HBM packages (one to each tile) will be placed alongside the compute dies for a total of 64GB cache or high-speed memory. Although the 4th Gen Xeon Scalable processors have a TDP of 225-350W, the load power draw can go over 400W, with a hard limit of 700W in the BIOS. With AMD primed to launch its 4th Gen Epyc Genoa processors later this year followed by Bergamo and Turin the next, Sapphire might just end up in the too little, too late category.

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