Intel has delayed the announcement of its $100 fabs in Europe and the US till 2022. As part of the chipmaker’s plans to regain process leadership from its East Asian rivals, plans to set up advanced wafer manufacturing facilities all over the world have been drawn up. The foundries in Arizona, Israel, Malaysia, and America have already received several billion-dollar expansion projects.
Although the immediate impact of this delay will be pretty much zero, it might push the company’s plans to mass-produce sub-4nm wafers to 2024-25. Each of the advanced foundries will cost around $100 billion and take up to an entire decade to be fully capable of achieving their set targets.
Two foundry complexes are on cards at the moment. One will be set up somewhere in the US, while the other (most likely) in Germany, Europe. The city-sized fab in the US will contain up to 6-8 modules and manufacture advanced process nodes as well as Intel’s packaging technologies such as Foveros, and EMIB.
The Europe fab in Germany will initially contain a fab worth $20 billion, with additional modules successively till 2030 for around $100 billion overall.
Intel originally planned to unveil the plans for these foundries by the end of 2021, but for reasons, not known has now decided to make the announcements in early 2022. These announcements could come as early as January, or as late as March as April.