Yangtze Memory Technologies Corp (YMTC) just became the first Chinese manufacturer to develop 128-layer QLC 3D NAND memory. The new QLC NAND chip, called the X2-6070 has a capacity of 1.33 Tb and utilizes YMTC’s Xtacking architecture.
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During the announcement, YMTC also talked about its plans for the X2-9060, a 512 Gb TLC NAND chip that’s designed for wider market uses. Where will these chips go? According to YMTC, the X2-6070 will first be deployed on consumer-level SSDs where the high level of I/O performance-up to 1.6 Gb/s, will make for an interesting challenger to established NVMe SSD manufacturers. After a commercial-oriented launch, YMTC aims to bring is product line to enterprise markets.
We don’t have additional technical details about either the YMTC X2-6070 or the YMTC X2-9060. However, we expect consumer parts to arrive later this year or early next year. We’ll keep you posted as we learn more.
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