AMD’s Radeon RX 7900 XT to Feature 7 Chiplets: Compute, Cache, and Bridge Interconnect?

AMD’s Radeon RX 7900 XT based on the RDNA 3 graphics architecture will feature up to 7 dies (chiplets). This was shared by well-reputed tipster Greymon55 who claims that there will be a total of seven dies powering the RDNA 3 flagship. Out of these, two will be the Graphics Compute Dies (GCDs), four Cache Dies (CDs), and one Active Bridge Interconnect (ABI).

The GCDs pack the main processing cluster across two identical dies. Each die will consist of 7,680 stream processors (cores) across 6 shader arrays and 3 shader engines. This results in an overall shader count of 15,360 spread across 12 shader arrays and 6 shader engines. The overall bus width is expected to be 256-bit with the memory controllers divided equally across the two dies.

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Credits: Olrak (Twitter)

With the 2nd Gen RDNA 2 GPUs, the L3 cache was on the GPU core die. However, with the Radeon RX 7900 XT/7800 XT, it has reportedly been shifted to separate cache dies. There will be four cache dies, 3D stacked on the GCDs (2 on each). These will pack a total last level cache of up to 256MB (512MB scrapped?).

Finally, there’s the Active Bridge Interconnect (ABI) which will pair the compute dies. Initially, it was thought that the ABI would contain the L3 cache above the GCDs but I’m not sure if that’s the case anymore. It’s important to remember that the last part is based on speculation. That one lone die could be the I/O die or something else entirely, so take it with a grain of salt.


Computer hardware enthusiast, PC gamer, and almost an engineer. Former co-founder of Techquila (2017-2019), a fairly successful tech outlet. Been working on Hardware Times since 2019, an outlet dedicated to computer hardware and its applications.
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