AMD’s next-gen Zen 4 3D processors are on track for a second-quarter launch next year. Based on the Zen 4 core architecture and the 2nd Gen V-Cache technology, these chips are set to offer even higher on-die bandwidth than their predecessor. The Ryzen 7 5800X3D is an excellent gaming CPU that sometimes can beat even the Ryzen 9 7950X and the Core i9-13900K. However, it suffers from overheating and can’t be overclocked because of a locked multiplier.
The Ryzen 7000X3D lineup will improve the stacked die thermal dissipation, allowing for higher boost clocks and flexible overclocking. Unfortunately, in contrast to what we’ve been hearing, the upcoming X3D chips won’t feature multiple compute dies.
According to ECSM_Official (Bilibili), the AM5 Zen 4 X3D lineup will consist of two SKUs: The six-core Ryzen 5 7600X3D and the eight-core Ryzen 7 7800X3D. Both single CCD processors are planned for a Q2 release alongside the budget A630 motherboards. In addition, the blogger states that there may be higher-end variants later next year, but that’s still up in the air.
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