AMD’s CPU roadmap has been laid bare by two reputed sources, MLID and DigiTimes. Most of the info is about the Next-Gen Ryzen 8000 mobile family with some basic data on the desktop, HEDT, and server lineups. Let’s begin with our favorite segment.
On the desktop front, the Ryzen 8000 lineup will succeed the existing Ryzen 7000 family in mid to late 2024. In contrast to what was reported earlier, these Zen 5 chips will be fabbed on TSMC’s 4nm “N4” node, an optimization of the 5nm “N5” process. The I/O die will continue to leverage the 6nm or N6 node.
The Ryzen 8000 mobile family will also leverage the 4nm node for all its SKUs. Strix Point, a hybrid-core design will feature a 4nm monolithic die while Strix Halo will pack a chiplet design with multiple dies based on the same node. The former will come with a TDP range of 15W (U-series) to 45W (H-series) while Halo will go as high as 120W, powering the fastest notebooks.
Hawk Point will refresh Phoenix Point like Lucienne was to Cezanne. It’ll retain the Zen 4 core architecture and the same version of the N4 node. While the two Strix lineups will be launched in 2024, the true low-power Zen 5 designs will arrive in 2025. Kraken Point and Escher have a TDP range of 15W to 28W.
Fire Range will succeed Dragon Range in the high-performance notebook segment with a TDP of over 45W. It’ll feature 16 Zen 5 cores on a chiplet-based design fabbed on TSMC’s 4nm process node. There’s also talk of Shimada Peak, a Zen 5-based Threadripper slated to launch in 2025. Not much is known about this stack.
Finally, we move to the Data Center market. It looks like the 5th Gen Epyc Family (Turin) will leverage TSMC’s 3nm node, the first AMD product to do so. Considering how AMD’s been doubling down on the high-margin data center market, this isn’t too far-fetched, and a launch window of 2025 makes it even more believable.