AMD will be launching its next-gen Ryzen 7000 processors as early as September 2022, claims a report from DigiTimes. Leveraging the Zen 4 core architecture and TSMC’s cutting-edge 5nm process, these chips are expected to retake the gaming crown from Intel’s 12th Gen Alder Lake CPUs. Rumors suggest an IPC gain of nearly 20%, and (all-core) boost clocks exceeding the 5GHz mark on the higher-end SKUs.
|Ryzen 1000: Zen||Summit Ridge||14nm||8/16||95W||AM4||DDR4-2677||24 x Gen 3.0||2017|
|Ryzen 2000: Zen+||Pinnacle Ridge||12nm||8/16||105W||AM4||DDR4-2933||24 x Gen 3.0||2018|
|Ryzen 3000: Zen 2||Matisse||7nm||16/32||105W||AM4||DDR4-3200||24 x Gen 4.0||H2 2019|
|Ryzen 5000: Zen 3||Vermeer||7nm||16/32||105W||AM4||DDR4-3200||24 x Gen 4.0||H2 2020|
|Ryzen 7000: Zen 4||Raphael||5nm||16/32||105-170W||AM5||DDR5-5600?||28 x Gen 5.0||H2 2022|
In addition to adopting the brand new AM5 platform and the LGA1718 socket (from BGA), AMD will be introducing DDR5 and PCIe Gen 5 support to its mainstream processors. Intel’s XMP profiles will also be replaced with AMD’s very-own high-speed memory profiles. While the compute dies will be fabbed on TSMC’s 5nm node, the I/O die will leverage the more mature N6 process.
If the hard launch is targeted for fall, then we can expect the announcement to come as early as Computex 2022 later this month. AMD CEO Dr. Lisa Su is going to kick off the event with a keynote on the 28th of May.
Alongside the Ryzen 7000 CPUs, the chipmaker will also launch the 600 series motherboards, including the B650 and the X670 chipsets. The latter will pack two B650 dies, doubling the I/O capabilities. This means that upgrading will require a full set of hardware, including a new motherboard, DDR5 memory (DDR4 won’t be supported), and for best results, a PCIe Gen 5 power supply as well. As a result, many users will stick to the Ryzen 7 5800X3D and wait for prices to drop.