AMD Ryzen 6000 “Vermeer” (Zen 4) CPU Package and IHS Design Surfaces

The CPU package and IHS design of AMD’s next-gen Zen 4 Ryzen 6000 processors have been shared by @ExecFix on Twitter. The Vermeer CPUs seem to have a radically different IHS with curved, (teeth-like) protruding edges. While it’s possible that the final design may change, this is the tentative design of the outer shell of the Zen 4 consumer SKUs.

Zen 4 will use TSMC’s 5nm EUV node, most likely with an increased overall chiplet count on the highest-end parts. The individual die size shouldn’t change by much though. At the moment, there’s no clear ETA on the launch date of Vermeer, but as per AMD’s roadmap, we should see the new processors towards the end of 2022. We are likely going to see a Zen 3 refresh with the Ryzen 5000 XT naming scheme sometime in the near future.


Computer Engineering dropout (3 years), writer, journalist, and amateur poet. I started my first technology blog, Techquila while in college to address my hardware passion. Although largely successful, it was a classic example of too many people trying out multiple different things but getting nothing done. Left in late 2019 and been working on Hardware Times ever since.

Leave a Reply

Your email address will not be published. Required fields are marked *

Back to top button