AMD Ryzen 6000 “Vermeer” (Zen 4) CPU Package and IHS Design Surfaces

The CPU package and IHS design of AMD’s next-gen Zen 4 Ryzen 6000 processors have been shared by @ExecFix on Twitter. The Vermeer CPUs seem to have a radically different IHS with curved, (teeth-like) protruding edges. While it’s possible that the final design may change, this is the tentative design of the outer shell of the Zen 4 consumer SKUs.

Zen 4 will use TSMC’s 5nm EUV node, most likely with an increased overall chiplet count on the highest-end parts. The individual die size shouldn’t change by much though. At the moment, there’s no clear ETA on the launch date of Vermeer, but as per AMD’s roadmap, we should see the new processors towards the end of 2022. We are likely going to see a Zen 3 refresh with the Ryzen 5000 XT naming scheme sometime in the near future.


Computer hardware enthusiast, PC gamer, and almost an engineer. Former co-founder of Techquila (2017-2019), a fairly successful tech outlet. Been working on Hardware Times since 2019, an outlet dedicated to computer hardware and its applications.

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