AMD Reportedly Books 5nm and 3nm Capacity with TSMC for 2022, 2023

According to a report from Fast Technology, AMD has booked its share of 5nm and 3nm capacity with TSMC for the next two years to ensure it gets enough wafers to satisfy growing consumer demand. The two companies will be collaborating in the second half of the year to increase the production capacity of TSMC’s most advanced nodes, most notably N5 and N6. This particular expansion will be aimed at increasing the production of chiplet-based designs that will become the basis of AMD’s Radeon products as well.

The source indicates that AMD has booked its share of 5nm and 3nm capacity in addition to the existing 7nm and 6nm capacity for 2022 and 2023. This makes sense as the company’s first 5nm products in the form of Zen 4 are slated to launch in the last quarter of 2022, with 4nm Zen 5 products expected sometime between 2023-24. Risk production for the former will start in the first half of 2022 itself. It was earlier shared by some insiders that the Zen 5-based SKUs will be called the Ryzen 8000 processors (codenamed “Granite Ridge”), with the APU lineup dubbed Ryzen 8000G (codenamed “Strix Point”). (thegamedial.com) The latter is supposed to feature a hybrid core architecture with Zen 5-based high-performance cores and Zen 4D-based low-power cores.

Going by this naming, this would mean that the Zen 4-based lineup will be either named Ryzen 7000 or we’d get an interim lineup in between. There’s also the possibility that the Zen 3 refresh (Warhol), based on the N6/6nm node is still alive and may get the Ryzen 6000 designation. However, we’re more likely to get them in the form of the Ryzen 5000 XT processors.



Computer hardware enthusiast, PC gamer, and almost an engineer. Former co-founder of Techquila (2017-2019), a fairly successful tech outlet. Been working on Hardware Times since 2019, an outlet dedicated to computer hardware and its applications.
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