GPUsNews

AMD Radeon MCM GPU Proof of Concept Surfaces for CDNA w/ HBM Memory

A patent illustrating AMD’s plans to move to a chiplet or MCM design with its Radeon GPUs has been shared by Twitter user, Underfox. Although this is still just the proof of concept, it does mean that both AMD and NVIDIA will make the jump in the next 4-5 years. Let’s have a look:

This diagram immediately reminds me of Intel’s Ponte Vecchio block diagram. You’ve got both single-precision and double-precision compute units across multiple dies connected using Intel’s EMIB interconnect.

AMD will of course use its highly scalable Infinity Fabric, but the structure seems very similar. Team Red appears to be using four dies with two HBM2 memory stacks on each one. This will likely form an Exascale GPU powered by the CNDA architecture with double precision capabilities, and will likely complement the Zen 4 based Genoa server CPU. Like Intel, AMD likely won’t use stacking for its compute dies, but HBM stacking will most likely be leveraged as the block diagram indicates (3-Hi stacks).

Regardless, this means that the MCM design will first come to the Data Center and server space (unsurprisingly) as the bandwidth and compute requirement in this segment is vastly higher than that required by gamers.

Areej

Computer Engineering dropout (3 years), writer, journalist, and amateur poet. I started Techquila while in college to address my hardware passion. Although largely successful, it suffered from many internal weaknesses. Left and now working on Hardware Times, a site purely dedicated to. Processor architectures and in-depth benchmarks. That's what we do here at Hardware Times!

Leave a Reply

Your email address will not be published. Required fields are marked *

This site uses Akismet to reduce spam. Learn how your comment data is processed.

Back to top button