Reputed leaker @ExecutableFix (Twitter) has once again shared a mockup of the AM5 socket along with the expected IHS (integrated heat spreader) of AMD’s next-gen Zen 4 Ryzen processors. As already reported a few months back, AMD will transition from a BGA to an LGA (1718) socket, similar to Intel. This means that the pins will be located on the socket, rather than the processor.
As you can probably guess, this will result in fewer CPU RMAs (and increased motherboard RMAs), and considering the growing complexity of processors was inevitable. AMD CEO Dr. Lisa Su confirmed at the company’s Q2 2021 earnings report that the Zen 4 processors along with the chiplet-based RDNA 3 GPUs are on track for a Q4 2022 launch. The MI200 data center GPU has already started shipping to select customers.
