Additional details regarding AMD’s next-gen AM5 socket have surfaced. It would seem that the existing heatsinks will be compatible with the new socket even though it will be a drastically new design compared to its predecessor. The two-piece retention frame will be retained to allow the use of older heatsinks with the new processors. However, the chip itself will be fastened by a metal enclosure.
The design of the socket and the IHS is much like the mockups shared by @ExecutableFix several months back.
Alongside the socket diagrams, the TDP targets of the next-gen Ryzen processors were also shared. There are five different product stacks (by TDP) with a stock TDP of 45W, 65W, 95W, 105W, 120W, and 170W. The latter requires 280mm or 360mm liquid coolers, specifically designed for enthusiasts and overclockers with high voltages and boost clocks that generally favor gaming workloads. Below, we have the 95W, 105W, and 120W SKUs representing the X-series processors already present in existing lineups.
Finally, we’ve got the 65W non-X SKUs and the 45W cTDP variants usually seen with pre-builds and OEM PCs rather than the DIY markets. These should come with a stock cooler, while the rest will need a third-party aftermarket heatsink.
Before AMD completely moves onto the AM5 socket, we expect to see the Zen 3 refresh and Zen 3D (V-Cache) lineups on AM4, sometime in early 2022. These chips are rumored to leverage the 6nm (7nm enhanced) node from TSMC, in addition to advanced L3 cache for the latter, but the core architecture should be the same as Vermeer (Zen 3).
Source: Ulysses
